? semiconductor components industries, llc, 2002 april, 2002 rev. 0 1 publication order number: mmbta06wt1/d mmbta06wt1 driver transistor npn silicon moisture sensitivity level: 1 esd rating: human body model 4 kv esd rating: machine model 400 v maximum ratings rating symbol value unit collectoremitter voltage v ceo 80 vdc collectorbase voltage v cbo 80 vdc emitterbase voltage v ebo 4.0 vdc collector current continuous i c 500 madc thermal characteristics characteristic symbol max unit total device dissipation fr5 board t a = 25 c p d 150 mw thermal resistance, junction to ambient r ja 833 c/w junction and storage temperature t j , t stg 55 to +150 c device package shipping ordering information mmbta06wt1 sc70 sc70 case 419 style 3 3000/t ape & reel 2 3 1 marking diagram gm d gm = specific device code d = date code collector 3 1 base 2 emitter http://onsemi.com
mmbta06wt1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics collectoremitter breakdown v oltage (note 1) (i c = 1.0 madc, i b = 0) v (br)ceo 80 vdc emitterbase breakdown voltage (i e = 100 adc, i c = 0) v (br)ebo 4.0 vdc collector cutoff current (v ce = 60 vdc, i b = 0) i ces 0.1 adc collector cutoff current (v cb = 80 vdc, i e = 0) i cbo 0.1 adc on characteristics dc current gain (i c = 10 madc, v ce = 1.0 vdc) (i c = 100 madc, v ce = 1.0 vdc) h fe 100 100 collector emitter saturation v oltage (i c = 100 madc, i b = 10 madc) v ce(sat) 0.25 vdc baseemitter on voltage (i c = 100 madc, v ce = 1.0 vdc) v be(on) 1.2 vdc smallsignal characteristics currentgain bandwidth product (note 2) (i c = 10 ma, v ce = 2.0 v, f = 100 mhz) f t 100 mhz 1. pulse test: pulse width 300 s, duty cycle 2.0%. 2. f t is defined as the frequency at which |h fe | extrapolates to unity. figure 1. switching time test circuits output turn-on time -1.0 v v cc +40 v r l * c s 6.0 pf r b 100 100 v in 5.0 f t r = 3.0 ns 0 +10 v 5.0 s output turn-off time +v bb v cc +40 v r l * c s 6.0 pf r b 100 100 v in 5.0 f t r = 3.0 ns 5.0 s *total shunt capacitance of test jig and connectors for pnp test circuits, reverse all voltage polarities
mmbta06wt1 http://onsemi.com 3 figure 2. currentgain e bandwidth product figure 3. capacitance figure 4. switching time 100 200 2.0 i c , collector current (ma) 300 200 100 70 50 30 10 100 0.1 v r , reverse voltage (volts) 80 60 40 20 10 8.0 20 v ce = 2.0 v t j = 25 c t j = 25 c 3.0 5.0 7.0 10 20 30 50 70 f t , current-gain - bandwidth product (mhz ) 50 1.0 2.0 5.0 0.2 0.5 6.0 4.0 c ibo c obo 20 10 i c , collector current (ma) 200 100 50 20 10 100 t, time (ns) 50 200 500 1.0 k 500 v cc = 40 v i c /i b = 10 i b1 = i b2 t j = 25 c t s t f t r 5.0 7.0 30 70 300 700 30 70 t d @ v be(off) = 0.5 v c, capacitance (pf) 300 figure 5. activeregion safe operating area 10 1.0 v ce , collector-emitter voltage (volts) 500 200 100 50 20 10 30 i c , collector current (ma) 2.0 5.0 50 1.0 k 1.0 ms 1.0 s t a = 25 c current limit thermal limit second breakdown limit 100 70 20 3.0 7.0 100 s t c = 25 c 700 300 30 70 figure 6. dc current gain 2.0 500 0.5 i c , collector current (ma) 400 200 100 80 60 40 10 , dc current gain t j = 125 c 1.0 3.0 5.0 v ce = 1.0 v 20 100 30 50 200 300 h fe 25 c -55 c figure 7. aono voltages 10 500 1.0 i c , collector current (ma) 1.0 0.8 0.6 0.4 0.2 0 100 t j = 25 c v, voltage (volts) v be(sat) @ i c /i b = 10 v ce(sat) @ i c /i b = 10 v be(on) @ v ce = 1.0 v 0.5 2.0 5.0 200 20 50
mmbta06wt1 http://onsemi.com 4 figure 8. collector saturation region figure 9. baseemitter temperature coefficient 100 500 0.5 i c , collector current (ma) -0.8 -1.2 -1.6 -2.0 -2.4 -2.8 0.1 10 0.05 i b , base current (ma) 1.0 0.8 0.6 0.4 0.2 0 1.0 t j = 25 c r vb , temperature coefficient (mv/ c) 10 r vb for v be 50 i c = 100 ma i c = 50 ma i c = 250 ma i c = 500 ma i c = 10 ma , collector-emitter voltage (volts) v ce 1.0 2.0 5.0 20 50 200 20 2.0 5.0 0.2 0.5
mmbta06wt1 http://onsemi.com 5 p d = t j(max) t a r q ja p d = 150 c 25 c 833 c/w = 150 milliwatts ? the soldering temperature and time should not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient should be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied dur- ing cooling * soldering a device without preheating can cause exces- sive thermal shock and stress which can result in damage to the device. information for using the sc70/sot323 surface mount package minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the to- tal design. the footprint for the semiconductor packages must be the correct size to insure proper solder connection sc70/sot323 power dissipation the power dissipation of the sc70/sot323 is a func- tion of the pad size. this can vary from the minimum pad size for soldering to the pad size given for maximum pow- er dissipation. power dissipation for a surface mount de- vice is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient; and the operating tempera- ture, t a . using the values provided on the data sheet, p d can be calculated as follows. the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 150 milliwatts. the 833 c/w assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milliwatts. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad, a higher power dissipation can be achieved using the same footprint. interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to mini- mize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. mm inches 0.035 0.9 0.075 0.7 1.9 0.028 0.65 0.025 0.65 0.025
mmbta06wt1 http://onsemi.com 6 package dimensions c n a l d g s b h j k 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim min max min max millimeters inches a 0.071 0.087 1.80 2.20 b 0.045 0.053 1.15 1.35 c 0.032 0.040 0.80 1.00 d 0.012 0.016 0.30 0.40 g 0.047 0.055 1.20 1.40 h 0.000 0.004 0.00 0.10 j 0.004 0.010 0.10 0.25 k 0.017 ref 0.425 ref l 0.026 bsc 0.650 bsc n 0.028 ref 0.700 ref s 0.079 0.095 2.00 2.40 0.05 (0.002) style 3: pin 1. base 2. emitter 3. collector sc70/sot323 case 41904 issue l
mmbta06wt1 http://onsemi.com 7 notes
mmbta06wt1 http://onsemi.com 8 on semiconductor is a trademark and is a registered trademark of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circui t, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may b e provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its paten t rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into t he body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employ er. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mmbta06wt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada
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